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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology

Year : 1990 Volume number : 13 Issue: 01

Switching Performance Of Agw-Ag(Sn,In)O And Agw-Agsno2 Contact Pairs (Article)
Subject: Switching , Performance Of Agw-Ag(Sn, In)O , Agw-Agsno2 , Contact Pairs
Author: Paul G. Slade      John A. Bindas     
page:      02 - 12
A Wafer Design Problem In Semiconductor Manufacturing For Reliable Customer Service (Article)
Subject: Semiconductor Manufacturing , Wafer Design Problem , Reliable Customer Service
Author: Medini R. Singh      Chacko T. Abraham      Ramakrishna Akella     
page:      103 - 108
Analysis Of Printed Wiring Board Assembly System (Article)
Subject: Board , Assembly System , Analysis Of Printed , Manufacturing
Author: Morris R. Driels      John S. Klegka     
page:      109 - 118
Solder Bumper Formation Using Electroless Plating And Ultrasonic Soldering (Article)
Subject: Solder Bump Radius , Electroless Plating , Ultrasonic , Formation
Author: Michihiko Inaba      Koji Yamakawa      Nobuo Iwase     
page:      119 - 123
Stiffness Of `Gull-Wing' Leads And Solder Joints For A Plastic Quad Flat Pack (Article)
Subject: Stiffness , Solder Joint Reliability , Plastic , Plastic Quad Flat Pack
Author: John H. Lau      Girvin Harkins     
page:      124 - 130
Role Of The Metallic Phase Arc Discharge On Arc Erosion In Ag Contacts (Article)
Subject: Metallic , Arc Discharge , Arc Erosion , Ag Contacts
Author: Hideaki Sone      Tasuku Takagi     
page:      13 - 19
Index-Matching Elastomers For Fiber Optics (Article)
Subject: Index System , Matching System , Elastomer , Fiber Optics
Author: C. P. Wong      Robert W. Filas      Bertrand H. Johnson     
page:      133 - 136
Applications Of Fiber-Optic Sensors (Article)
Subject: Fiber-Optic Sensor , Chemical Sensor , Intensity , Parameters
Author: Alan D. Kersey      Anthony Dandridge     
page:      137 - 143
Polymeric Optical Mixing Rod Coupler (Article)
Subject: Optical , Mixing , Polymeric , Rod Coupler
Author: Gary Grimes      Lee L. Blyler Jr.     
page:      144 - 146
Inductance Calculation And Optimal Pin Assignment For The Design Of Pin-Grid-Array And Chip Carrier Packages (Article)
Subject: Inductance Calculation , Optimal Pin Assignment , Pin-Grid-Array , Chip Carrier Packages
Author: Udbhava A. Shrivastava      B. Lan Bui     
page:      147 - 153
Frequency-Dependent Inductance And Resistance Calculation For Three-Dimensional Structures In High-Speed Interconnect Systems (Article)
Subject: Three-Dimensional Structure , High-Speed Interconnect , Frequency-Dependent Inductance , Resistance Calculation
Author: Andreas C. Cangellaris      John L. Prince     
page:      154 - 159
Simulation Of Transients In Vlsi Packaging Interconnections (Article)
Subject: Simulation , Transients , Vlsi , Packaging
Author: J. C Liao      John L. Prince      Andreas C. Cangellaris     
page:      160 - 166
The Effect Of High-Temperature Intermetallic Growth On Ball Shear-Induced Cratering (Article)
Subject: High-Temperature , Intermetallic , Ball Shear-Induced Cratering , Shear-Induced
Author: Guy V. Clatterbaugh      Harry K. Charles, Jr     
page:      167 - 175
A Transmission Electron Microscopy Study Of Ultrasonic Wire Bonding (Article)
Subject: Transmission Electron Microscopy , Ultrasonic , Wire Bonding
Author: James E. Krzanowski     
page:      176 - 181
Thermal Stress Analysis Of Tape Automated Bonding Packages And Interconnections (Article)
Subject: Thermal Stress Analysis , Automated Analysis , Bonding , Interconnections
Author: John H. Lau      Girvin Harkins     
page:      182 - 187
Corrosion Of Pb-50in Flip-Chip Interconnections Exposed To Harsh Environment (Article)
Subject: Corrosion , Flip Chip , Interconnections , Harsh Environment
Author: Karl J. Puttlitz     
page:      188 - 193
Thermal-Stress Analysis With Electrical Equivalents (Article)
Subject: Thermal Stress Analysis , Electrical Equivalence
Author: Dietrich E. Riemer     
page:      194 - 199
A Holographic Measurement Of Microscopical Sliding Of Electrical Contact Due To Contact Spring Thermal Deformation (Article)
Subject: Electrical Contact , Spring , Thermal Deformation , Holographic Measurement Of Microscopical Sliding
Author: M Taniguchi      Hideaki Sone      Tasuku Takagi     
page:      20 - 26
High-Density Interconnection Using Photosensitive Polyimide And Electroplated Copper Conductor Lines (Article)
Subject: High Density , Interconnections , Polyimide , Electroplated Copper
Author: K.K. Chakravorty      C.P. Chien     
page:      200 - 206
Evaluation Of Polyimides As Dielectric Materials For Multichip Packages With Multilevel Interconnection Structure (Article)
Subject: Evaluation , Polyimides , Dielectric Materials , Multilevel Systems
Author: A.W. Lin     
page:      207 - 213
Enhanced Moisture Protection Of Electronic Devices By Ultra-Thin Polyimide Films (Article)
Subject: Enhanced Moisture Protection Of Electronic Devices , Moisture Protection , Ultra-Thin Polyimide Films , Polyimide Films
Author: A.W. Lin      John J. Burack     
page:      214 - 218
Brazing To Low-Temperature-Fired Thick Films (Article)
Subject: Brazing , Low-Temperature , Thick Films
Author: Roupen L. Keusseyan     
page:      219 - 221
Inner Lead Bonding Technique For 500-Lead Dies Having A 90-Um Lead Pitch (Article)
Subject: Deformation , Inner Lead Bonding Technique , 500-Lead Dies , Degradation
Author: Koichiro Atsumi      Noriyasu Kashima     
page:      222 - 228
Direct Chip Interconnect Using Polymer Bonding (Article)
Subject: Interconnect , Direct Chip , Polymer Bonding
Author: Ken Gilleo     
page:      229 - 234
Corrosive Gas Environmental Testing For Electrical Contacts (Article)
Subject: Electrical Contact , Gas , Gas Environmental Testing , Corrosive
Author: Rich Witska      Randy R. Gore      J. Ray Kirby      James L. Chao     
page:      27 - 32
Formation Of Palladium Oxides By Mechanochemical Reaction On Pd And Ag-Pd Alloy Contacts (Article)
Subject: Palladium , Oxide , Mechanochemical Reaction , Formation
Author: Makoto Hasegawa      Koichiro Sawa     
page:      33 - 39
The Corrosion Of Copper And Porous Gold In Flowing Mixed Gas Environments (Article)
Subject: Corrosion , Copper , Porous , Gas Environmental Testing
Author: William H. Abbott     
page:      40 - 45
Effects Of Dust On Various Lubricated Sliding Contacts (Article)
Subject: Dust , Lubrication , Electrical Contact , Mobility
Author: Ji-Gao Zhang      Chun-Hui Mei      Xiao-Min Wen     
page:      46 - 51
Enhanced Surface Segregation In Sliding Wear Tracks (Article)
Subject: Segregation , Sliding Wear , Track Design , Phenomenon
Author: R Kothari      Ji-Gao Zhang     
page:      52 - 55
Erosion Behavior And `Erodibility' Of Ag/Cdo And Ag/Sno2 Contacts Under Ac 3 And Ac 4 Test Conditions (Article)
Subject: Erosion , Determining System , Prestressed Members , Erodibility
Author: Werner Rieder     
page:      56 - 64
A Possible Degeneration Mechanism In Stationary Electrical Contacts (Article)
Subject: Mechanism , Stationary , Electrical Contact , Possible Degeneration Mechanism
Author: Roland S. Timsit     
page:      65 - 68
The Influence Of Circuit Parameters And Contact Materials On The Reignition Of High-Frequency Vacuum Arcs (Article)
Subject: Contact Material , High-Frequency , Vacuum Arc Melting , Reignition
Author: Manfred Lindmayer      Ernst-Dieter Wilkening     
page:      69 - 73
Metallurgic And Contact Resistance Studies Of Sleeve Connectors In Aluminum Cable Splices (Article)
Subject: Contact Resistance , Connectors , Aluminum , Aluminum Cable Splices
Author: Milenko Braunovic      Chinh Dang     
page:      74 - 80
System Life Cycle Engineering And Df`X' (Article)
Subject: Life Cycle , Df 'X' , System Life Cycle Engineering
Author: L. Ken Keys     
page:      83 - 93
Developing A Decision Support System For Optimizing Automated Wafer Fabrication (Article)
Subject: Decision Support System , Optimizing , Automated , Wafer Fabrication
Author: Devadas D. Pillai     
page:      94 - 102