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Your search returned 35 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
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Year : 1990 Volume number : 13 Issue: 01 |
Switching Performance Of Agw-Ag(Sn,In)O And Agw-Agsno2 Contact Pairs
(Article)
Subject:
Switching
,
Performance Of Agw-Ag(Sn, In)O
,
Agw-Agsno2
,
Contact Pairs
Author:
Paul G.
Slade
John A.
Bindas
page:
02
-
12
A Wafer Design Problem In Semiconductor Manufacturing For Reliable Customer Service
(Article)
Subject:
Semiconductor Manufacturing
,
Wafer Design Problem
,
Reliable Customer Service
Author:
Medini R.
Singh
Chacko T.
Abraham
Ramakrishna
Akella
page:
103
-
108
Analysis Of Printed Wiring Board Assembly System
(Article)
Subject:
Board
,
Assembly System
,
Analysis Of Printed
,
Manufacturing
Author:
Morris R.
Driels
John S.
Klegka
page:
109
-
118
Solder Bumper Formation Using Electroless Plating And Ultrasonic Soldering
(Article)
Subject:
Solder Bump Radius
,
Electroless Plating
,
Ultrasonic
,
Formation
Author:
Michihiko
Inaba
Koji
Yamakawa
Nobuo
Iwase
page:
119
-
123
Stiffness Of `Gull-Wing' Leads And Solder Joints For A Plastic Quad Flat Pack
(Article)
Subject:
Stiffness
,
Solder Joint Reliability
,
Plastic
,
Plastic Quad Flat Pack
Author:
John H.
Lau
Girvin
Harkins
page:
124
-
130
Role Of The Metallic Phase Arc Discharge On Arc Erosion In Ag Contacts
(Article)
Subject:
Metallic
,
Arc Discharge
,
Arc Erosion
,
Ag Contacts
Author:
Hideaki
Sone
Tasuku
Takagi
page:
13
-
19
Index-Matching Elastomers For Fiber Optics
(Article)
Subject:
Index System
,
Matching System
,
Elastomer
,
Fiber Optics
Author:
C. P.
Wong
Robert W.
Filas
Bertrand H.
Johnson
page:
133
-
136
Applications Of Fiber-Optic Sensors
(Article)
Subject:
Fiber-Optic Sensor
,
Chemical Sensor
,
Intensity
,
Parameters
Author:
Alan D.
Kersey
Anthony
Dandridge
page:
137
-
143
Polymeric Optical Mixing Rod Coupler
(Article)
Subject:
Optical
,
Mixing
,
Polymeric
,
Rod Coupler
Author:
Gary
Grimes
Lee L.
Blyler Jr.
page:
144
-
146
Inductance Calculation And Optimal Pin Assignment For The Design Of Pin-Grid-Array And Chip Carrier Packages
(Article)
Subject:
Inductance Calculation
,
Optimal Pin Assignment
,
Pin-Grid-Array
,
Chip Carrier Packages
Author:
Udbhava A.
Shrivastava
B. Lan
Bui
page:
147
-
153
Frequency-Dependent Inductance And Resistance Calculation For Three-Dimensional Structures In High-Speed Interconnect Systems
(Article)
Subject:
Three-Dimensional Structure
,
High-Speed Interconnect
,
Frequency-Dependent Inductance
,
Resistance Calculation
Author:
Andreas C.
Cangellaris
John L.
Prince
page:
154
-
159
Simulation Of Transients In Vlsi Packaging Interconnections
(Article)
Subject:
Simulation
,
Transients
,
Vlsi
,
Packaging
Author:
J. C
Liao
John L.
Prince
Andreas C.
Cangellaris
page:
160
-
166
The Effect Of High-Temperature Intermetallic Growth On Ball Shear-Induced Cratering
(Article)
Subject:
High-Temperature
,
Intermetallic
,
Ball Shear-Induced Cratering
,
Shear-Induced
Author:
Guy V.
Clatterbaugh
Harry K.
Charles, Jr
page:
167
-
175
A Transmission Electron Microscopy Study Of Ultrasonic Wire Bonding
(Article)
Subject:
Transmission Electron Microscopy
,
Ultrasonic
,
Wire Bonding
Author:
James E.
Krzanowski
page:
176
-
181
Thermal Stress Analysis Of Tape Automated Bonding Packages And Interconnections
(Article)
Subject:
Thermal Stress Analysis
,
Automated Analysis
,
Bonding
,
Interconnections
Author:
John H.
Lau
Girvin
Harkins
page:
182
-
187
Corrosion Of Pb-50in Flip-Chip Interconnections Exposed To Harsh Environment
(Article)
Subject:
Corrosion
,
Flip Chip
,
Interconnections
,
Harsh Environment
Author:
Karl J.
Puttlitz
page:
188
-
193
Thermal-Stress Analysis With Electrical Equivalents
(Article)
Subject:
Thermal Stress Analysis
,
Electrical Equivalence
Author:
Dietrich E.
Riemer
page:
194
-
199
A Holographic Measurement Of Microscopical Sliding Of Electrical Contact Due To Contact Spring Thermal Deformation
(Article)
Subject:
Electrical Contact
,
Spring
,
Thermal Deformation
,
Holographic Measurement Of Microscopical Sliding
Author:
M
Taniguchi
Hideaki
Sone
Tasuku
Takagi
page:
20
-
26
High-Density Interconnection Using Photosensitive Polyimide And Electroplated Copper Conductor Lines
(Article)
Subject:
High Density
,
Interconnections
,
Polyimide
,
Electroplated Copper
Author:
K.K.
Chakravorty
C.P.
Chien
page:
200
-
206
Evaluation Of Polyimides As Dielectric Materials For Multichip Packages With Multilevel Interconnection Structure
(Article)
Subject:
Evaluation
,
Polyimides
,
Dielectric Materials
,
Multilevel Systems
Author:
A.W.
Lin
page:
207
-
213
Enhanced Moisture Protection Of Electronic Devices By Ultra-Thin Polyimide Films
(Article)
Subject:
Enhanced Moisture Protection Of Electronic Devices
,
Moisture Protection
,
Ultra-Thin Polyimide Films
,
Polyimide Films
Author:
A.W.
Lin
John J.
Burack
page:
214
-
218
Brazing To Low-Temperature-Fired Thick Films
(Article)
Subject:
Brazing
,
Low-Temperature
,
Thick Films
Author:
Roupen L.
Keusseyan
page:
219
-
221
Inner Lead Bonding Technique For 500-Lead Dies Having A 90-Um Lead Pitch
(Article)
Subject:
Deformation
,
Inner Lead Bonding Technique
,
500-Lead Dies
,
Degradation
Author:
Koichiro
Atsumi
Noriyasu
Kashima
page:
222
-
228
Direct Chip Interconnect Using Polymer Bonding
(Article)
Subject:
Interconnect
,
Direct Chip
,
Polymer Bonding
Author:
Ken
Gilleo
page:
229
-
234
Corrosive Gas Environmental Testing For Electrical Contacts
(Article)
Subject:
Electrical Contact
,
Gas
,
Gas Environmental Testing
,
Corrosive
Author:
Rich
Witska
Randy R.
Gore
J. Ray
Kirby
James L.
Chao
page:
27
-
32
Formation Of Palladium Oxides By Mechanochemical Reaction On Pd And Ag-Pd Alloy Contacts
(Article)
Subject:
Palladium
,
Oxide
,
Mechanochemical Reaction
,
Formation
Author:
Makoto
Hasegawa
Koichiro
Sawa
page:
33
-
39
The Corrosion Of Copper And Porous Gold In Flowing Mixed Gas Environments
(Article)
Subject:
Corrosion
,
Copper
,
Porous
,
Gas Environmental Testing
Author:
William H.
Abbott
page:
40
-
45
Effects Of Dust On Various Lubricated Sliding Contacts
(Article)
Subject:
Dust
,
Lubrication
,
Electrical Contact
,
Mobility
Author:
Ji-Gao
Zhang
Chun-Hui
Mei
Xiao-Min
Wen
page:
46
-
51
Enhanced Surface Segregation In Sliding Wear Tracks
(Article)
Subject:
Segregation
,
Sliding Wear
,
Track Design
,
Phenomenon
Author:
R
Kothari
Ji-Gao
Zhang
page:
52
-
55
Erosion Behavior And `Erodibility' Of Ag/Cdo And Ag/Sno2 Contacts Under Ac 3 And Ac 4 Test Conditions
(Article)
Subject:
Erosion
,
Determining System
,
Prestressed Members
,
Erodibility
Author:
Werner
Rieder
page:
56
-
64
A Possible Degeneration Mechanism In Stationary Electrical Contacts
(Article)
Subject:
Mechanism
,
Stationary
,
Electrical Contact
,
Possible Degeneration Mechanism
Author:
Roland S.
Timsit
page:
65
-
68
The Influence Of Circuit Parameters And Contact Materials On The Reignition Of High-Frequency Vacuum Arcs
(Article)
Subject:
Contact Material
,
High-Frequency
,
Vacuum Arc Melting
,
Reignition
Author:
Manfred
Lindmayer
Ernst-Dieter
Wilkening
page:
69
-
73
Metallurgic And Contact Resistance Studies Of Sleeve Connectors In Aluminum Cable Splices
(Article)
Subject:
Contact Resistance
,
Connectors
,
Aluminum
,
Aluminum Cable Splices
Author:
Milenko
Braunovic
Chinh
Dang
page:
74
-
80
System Life Cycle Engineering And Df`X'
(Article)
Subject:
Life Cycle
,
Df 'X'
,
System Life Cycle Engineering
Author:
L. Ken
Keys
page:
83
-
93
Developing A Decision Support System For Optimizing Automated Wafer Fabrication
(Article)
Subject:
Decision Support System
,
Optimizing
,
Automated
,
Wafer Fabrication
Author:
Devadas D.
Pillai
page:
94
-
102
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